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Program

The Technical Program can be downloaded here soon.


Confirmed Keynote Speakers

Prof. Bernhard Wunderle, Technische Universität Chemnitz, Germany
title follows

Prof. Lan Jiang, Beijing Institute of Technology, China
Electrons dynamics control in femtosecond laser materials processing

Prof. Martin Kuball, University of Bristol, United Kingdom
Challenges in power and microwave electronics

Prof. Oliver G. Schmidt, Technische Universitaet Chemnitz, Germany
Nanomaterials for flexible and three-dimensional microelectronic and microrobotic systems

Prof. Peter Herman, University of Toronto, Canada
Femtosecond laser processing in photonics – scribing, welding and 3D nano-structuring

Prof. Seung-Boo Jung, Sungkyunkwan University, Korea
Fabrication of metal based composite paste and its joining characteristics of electronic components with various energy sources

Prof. Yoshikazu Takahashi, Tohoku University, Japan
Power Module technology for high-power and high frequency WBG devices


Confirmed Invited Speakers


Prof. Chenxi Wang, Harbin Institute of Technology, China
Surface activated low-temperature bonding technology for 3D heterogeneous integration

Prof. Chihiro Iwamoto, Ibaraki University, Japan
Nano-scale analysis of joint interface by TEM

Prof. Hongjun Ji, Harbin Institute of Technology (Shenzhen), China
Cu@Ag nanoparticles: synthesis, characterization, sintering mechanism and applications
for power and flexible printed electronics

Prof. Michel Calame, EMPA, Switzerland
Can we control molecular devices down to the atomic scale?

Prof. Peng Peng, Beihang University, China
Direct selective laser nano-sintering of composite structures: process and application

Prof. Tetsu Yonezawa, Hokkaido University, Japan
Copper fine particle system for low temperature sintering

Prof. Yongfeng Lu, University of Nebraska-Lincoln, USA
Nanoscale 3D printing of functional structures using blended resin mixtures with micro/nanojoining of metallic nanowires

Prof. Yvonne Joseph, TU Bergakademie Freiberg, Germany
New Materials for Joining Microelectronic Components